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Chip Quik, Inc.

- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.

Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.

Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.

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Part Number
Manufacturer
Description
Unit Price
In Stock

PA0214 PA0214

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : LCC, JLCC, PLCC
Number of Positions : 32
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 1.600" (25.40mm x 40.64mm)
0
100 in stock

PA0214-S PA0214-S

Chip Quik, Inc.
Type : PLCC/JLCC
Number of Positions : 32
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.453" L x 0.551" W (11.50mm x 14.00mm)
Thermal Center Pad : -
0
100 in stock

PA0214SOCKET PA0214SOCKET

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : LCC, JLCC, PLCC
Number of Positions : 32
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 1.600" (25.40mm x 40.64mm)
0
122 in stock

PA0216 PA0216

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : TSOP
Number of Positions : 32
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 1.600" (25.40mm x 40.64mm)
0
100 in stock

PA0216-S PA0216-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 32
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock

PA0217 PA0217

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : TSOP
Number of Positions : 44
Pitch : 0.031" (0.80mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.200" (25.40mm x 55.88mm)
0
100 in stock

PA0217-S PA0217-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 44
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock

PA0218 PA0218

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : TSOP
Number of Positions : 28
Pitch : 0.022" (0.55mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 1.400" (25.40mm x 35.56mm)
0
100 in stock

PA0218-S PA0218-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 28
Pitch : 0.022" (0.55mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock

PA0219 PA0219

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : LCC, JLCC, PLCC
Number of Positions : 52
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.600" (25.40mm x 66.04mm)
0
100 in stock

PA0219-S PA0219-S

Chip Quik, Inc.
Type : PLCC/JLCC
Number of Positions : 52
Pitch : 0.050" (1.27mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.748" L x 0.748" W (19.00mm x 19.00mm)
Thermal Center Pad : -
0
100 in stock

PA0219SOCKET PA0219SOCKET

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : LCC, JLCC, PLCC
Number of Positions : 52
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.600" (25.40mm x 66.04mm)
0
24 in stock