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Chip Quik, Inc.

- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.

Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.

Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.

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Part Number
Manufacturer
Description
Unit Price
In Stock

PA0201 PA0201

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to PGA
Package Accepted : PQFP
Number of Positions : 160
Pitch : 0.026" (0.65mm)
Board Thickness : 0.063" (1.60mm)
Material : FR4 Epoxy Glass
Size / Dimension : 2.500" L x 2.500" W (63.50mm x 63.50mm)
0
100 in stock

PA0201-S PA0201-S

Chip Quik, Inc.
Type : PQFP
Number of Positions : 160
Pitch : 0.026" (0.65mm)
Outer Dimension : 1.800" L x 2.600" W (45.72mm x 66.04mm)
Inner Dimension : 1.102" L x 1.102" W (28.00mm x 28.00mm)
Thermal Center Pad : -
0
100 in stock

PA0202 PA0202

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to PGA
Package Accepted : PQFP, QFP, RQFP
Number of Positions : 208
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 3.100" x 3.100" (78.74mm x 78.74mm)
0
100 in stock

PA0202-S PA0202-S

Chip Quik, Inc.
Type : PQFP
Number of Positions : 208
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.800" L x 2.600" W (45.72mm x 66.04mm)
Inner Dimension : 1.102" L x 1.102" W (28.00mm x 28.00mm)
Thermal Center Pad : -
0
100 in stock

PA0203 PA0203

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to PGA
Package Accepted : LQFP
Number of Positions : 112
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.800" x 1.800" (45.72mm x 45.72mm)
0
100 in stock

PA0203-S PA0203-S

Chip Quik, Inc.
Type : LQFP
Number of Positions : 112
Pitch : 0.026" (0.65mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.787" L x 0.787" W (20.00mm x 20.00mm)
Thermal Center Pad : -
0
100 in stock

PA0205 PA0205

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to PGA
Package Accepted : RQFP, QFP
Number of Positions : 240
Pitch : 0.020" (0.50mm)
Board Thickness : 0.063" (1.60mm)
Material : FR4 Epoxy Glass
Size / Dimension : 3.500" L x 3.500" W (88.90mm x 88.90mm)
0
100 in stock

PA0205-S PA0205-S

Chip Quik, Inc.
Type : RQFP
Number of Positions : 240
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.800" L x 2.600" W (45.72mm x 66.04mm)
Inner Dimension : 1.260" L x 1.260" W (32.00mm x 32.00mm)
Thermal Center Pad : -
0
100 in stock

PA0206 PA0206

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : DFN
Number of Positions : 16
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 1.000" (17.78mm x 25.40mm)
0
100 in stock

PA0206-S PA0206-S

Chip Quik, Inc.
Type : DFN
Number of Positions : 16
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.157" W (5.00mm x 4.00mm)
Thermal Center Pad : 0.096" L x 0.354" W (2.45mm x 9.00mm)
0
100 in stock

PA0207 PA0207

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : TSOP
Number of Positions : 40
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.000" (25.40mm x 50.80mm)
0
100 in stock

PA0207-S PA0207-S

Chip Quik, Inc.
Type : TSOP
Number of Positions : 40
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : -
Thermal Center Pad : -
0
100 in stock