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Chip Quik, Inc.

- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.

Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.

Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.

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Part Number
Manufacturer
Description
Unit Price
In Stock

PA0168 PA0168

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MiniSOIC
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.400" (17.78mm x 10.16mm)
0
115 in stock

PA0168-S PA0168-S

Chip Quik, Inc.
Type : Mini SOIC
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock

PA0169 PA0169

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MiniSOIC
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.500" (17.78mm x 12.70mm)
0
100 in stock

PA0169-S PA0169-S

Chip Quik, Inc.
Type : Mini SOIC
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : -
0
100 in stock

PA0170 PA0170

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MiniSOIC EP
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.400" (17.78mm x 10.16mm)
0
100 in stock

PA0170-S PA0170-S

Chip Quik, Inc.
Type : Mini SOIC
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.067" L x 0.315" W (1.70mm x 8.00mm)
0
100 in stock

PA0171 PA0171

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : MiniSOIC EP
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.500" (17.78mm x 12.70mm)
0
100 in stock

PA0171-S PA0171-S

Chip Quik, Inc.
Type : Mini SOIC
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.067" L x 0.315" W (1.70mm x 8.00mm)
0
100 in stock

PA0172 PA0172

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : POS
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.400" (17.78mm x 10.16mm)
0
100 in stock

PA0172-S PA0172-S

Chip Quik, Inc.
Type : POS
Number of Positions : 8
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.098" W (3.00mm x 2.50mm)
Thermal Center Pad : -
0
100 in stock

PA0173 PA0173

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : PSOP
Number of Positions : 8
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 0.700" x 0.400" (17.78mm x 10.16mm)
0
100 in stock

PA0173-S PA0173-S

Chip Quik, Inc.
Type : PSOP
Number of Positions : 8
Pitch : 0.050" (1.27mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.155" L x 0.194" W (3.94mm x 4.93mm)
Thermal Center Pad : -
0
100 in stock