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Chip Quik, Inc.

- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.

Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.

Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.

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Part Number
Manufacturer
Description
Unit Price
In Stock

PA0065-S PA0065-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 28
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.197" W (5.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock

PA0066 PA0066

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QFN
Number of Positions : 28
Pitch : 0.031" (0.80mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 1.400" (25.40mm x 35.56mm)
0
100 in stock

PA0066-S PA0066-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 28
Pitch : 0.031" (0.80mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : -
0
100 in stock

PA0067 PA0067

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QFN
Number of Positions : 32
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 1.600" (25.40mm x 40.64mm)
0
152 in stock

PA0067-S PA0067-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 32
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.197" L x 0.197" W (5.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock

PA0068 PA0068

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QFN
Number of Positions : 32
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 1.600" (25.40mm x 40.64mm)
0
100 in stock

PA0068-S PA0068-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 32
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : -
0
100 in stock

PA0069 PA0069

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QFN THIN
Number of Positions : 36
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 1.800" (25.40mm x 45.72mm)
0
100 in stock

PA0069-S PA0069-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 36
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.236" L x 0.236" W (6.00mm x 6.00mm)
Thermal Center Pad : -
0
100 in stock

PA0070 PA0070

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QFN
Number of Positions : 40
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.000" (25.40mm x 50.80mm)
0
100 in stock

PA0070-S PA0070-S

Chip Quik, Inc.
Type : QFN/LFCSP
Number of Positions : 40
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.197" W (7.00mm x 5.00mm)
Thermal Center Pad : -
0
100 in stock

PA0071 PA0071

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : Proto-Advantage
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : QFN
Number of Positions : 40
Pitch : 0.020" (0.50mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 1.000" x 2.000" (25.40mm x 50.80mm)
0
13 in stock